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927 labs · 0 student voices
Masahito Mochizuki, Professor
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The Novel Joining Lab pioneers bio-inspired materials and production processes that weave together the “engineering knowledge” and “biological knowledge” accumulated by humanity and nature, for a low-carbon future society. The lab works on developing nanomaterials that save and generate energy using data science, and on their applications. It also studies multi-material technologies for joining and separating materials with completely different properties, fine-scale joining of electronic materials, and advanced semiconductor packaging. The lab investigates production processes, from the bonding of atoms and molecules to multi-material integration, using theory, experiments, and simulation.
Manabu Tanaka, Professor
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The Tanaka Lab studies the characteristics and control of high-density energy sources, and the optimization of energy transport. It also investigates the interaction between high-density energy sources and materials, and explores new high-density energy sources for high-precision, highly functional materials processing. It examines the generation, control, and heat transport phenomena of arc plasma, a representative high-density energy source, from both physical and chemical perspectives. On the lab's website, it is introduced under the name "Energy Control Science Division (Tanaka Lab)."
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The Plasma Properties and Engineering Lab aims to use plasma, which takes many diverse forms, freely to help solve important problems facing humanity, such as those in medicine, the environment, and energy. It covers basic plasma research through to various applied research that requires the integration of physics and chemistry. It works on developing, understanding, and controlling novel plasma sources for processes used in gas-phase, liquid-phase, and supercritical-fluid-phase environments. It also studies the creation of new functional surface materials, the synthesis of functional nanostructured materials, and applications to bio and environmental processes.
Shinji Fukumoto, Professor
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The Process Integration Lab studies fine joining (micro- and nano-joining) technologies, which are indispensable in electronics packaging and elsewhere. Electronic devices are multi-material structures in which metals, semiconductors, and organic compounds are packed tightly together. At tiny joints, the effects of phenomena that are not a problem in large joints, such as the amount of dissolution and surface tension (size effects), cannot be ignored. The lab aims to understand phenomena specific to tiny joints and to optimize joining processes and materials, achieving highly reliable and highly functional joints. On the lab's website, it is introduced under the name "Fukumoto Lab."
Masahito Mochizuki, Professor
0 student voices
The Process Mechanics Lab studies the mechanical phenomena that accompany material processing, including thermal processing, machining, and combined processing. Processes such as welding and joining, cutting, and machining cause mechanical effects like residual stress and deformation, which affect the performance and reliability of products and structures. By integrating materials science, process physics, and mechanical design, the lab develops simulation models of manufacturing processes, with the aim of predicting the properties of processed regions. The lab was established in 1964 as a chair dealing with welding mechanics, and has carried out education and research under the name Process Mechanics since 2009.
Hiroyuki Hirata, Professor
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The Process Metallurgy Lab aims to make the materials science of welding and joining more advanced and sophisticated, and carries out research that spans materials science, mechanics, and process engineering. For the phenomena of welding and joining, the lab works on clarifying and modeling welding metallurgy, and explores techniques for prediction and control. Its goals are to systematize process metallurgy for welding and joining and to establish technologies that contribute to improved reliability.
Tetsusei Kurashiki, Professor
0 student voices
The Reliability Assessment Lab centers on composite materials engineering, reliability engineering, and engineering education, and studies manufacturing in a wide range of fields, including biomedical engineering, energy and the environment, electronics, and disaster prevention. Through interdisciplinary integration and industry-academia collaboration, the lab carries out research and development of simulation technologies for creating new technologies, as well as of the new technologies themselves. On the lab's website, it is introduced under the name "Kurashiki Lab." In the graduate school, it is also in charge of the Technology Design chair of the Department of Business Engineering. Fourth-year undergraduates are assigned to the lab only from the Production Science Course of the Department of Applied Science and Engineering.
Tohru Sekino, Professor
0 student voices
The Advanced Hard Materials Lab (Sekino Lab) researches how to build materials, mainly ceramics and metals, through structural design and control from the nano to the macro scale. The lab makes bulk materials and nanomaterials with diverse functions, evaluates their structures and fundamental properties and characteristics, and clarifies the mechanisms behind them. Its goal is the research and development of advanced functional structural materials with new structural and functional properties. It aims to develop next-generation fundamental materials and their applications that help solve important challenges facing society today.
Tomokazu Sano, Professor
0 student voices
The Processing Physics Lab (Sano Lab) studies the physics of material processing using lasers and arc plasmas. By combining advanced measurement techniques with numerical simulation, the lab pursues the “universal truths” hidden in processing phenomena. Based on these truths, the lab aims to predict and control material processing phenomena and to create manufacturing with unprecedented value. The lab's day-to-day activities are shared on Instagram.
Hiroshi Nishikawa, Professor
0 student voices
The lab studies microjoining, from developing new joining materials for electronics packaging to establishing advanced joining processes and clarifying their mechanisms. The lab creates joining materials with excellent functionality and high reliability, and builds new microjoining processes that use various energy sources. It also investigates phenomena that occur at interfaces at the nano- and microscale, and works to improve the reliability of microjoints by controlling interface structure and function. While building the fundamental science, the lab also develops applied technologies for practical use. In the Graduate School of Engineering's lab directory, the lab is introduced under the name Microjoining Engineering Lab.
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