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Novel Joining Lab
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The lab studies technologies for joining and separating materials with very different properties.
AboutAbout the lab
Weaving engineering knowledge and biological knowledge to pioneer new materials and processes.
The Novel Joining Lab pioneers bio-inspired materials and production processes that weave together the “engineering knowledge” and “biological knowledge” accumulated by humanity and nature, for a low-carbon future society.
The lab works on developing nanomaterials that save and generate energy using data science, and on their applications.
It also studies multi-material technologies for joining and separating materials with completely different properties, fine-scale joining of electronic materials, and advanced semiconductor packaging.
The lab investigates production processes, from the bonding of atoms and molecules to multi-material integration, using theory, experiments, and simulation.
Key terms
- Multi-material
- An approach that combines multiple materials with different properties. The lab studies it as technology for joining and separating such materials
- Fine-scale joining
- Technology for bonding electronic materials together at very small dimensions. The lab studies it together with advanced semiconductor packaging
ResearchResearch themes
Aiming at a low-carbon future society, the lab pioneers bio-inspired materials and production processes that weave together “engineering knowledge” and “biological knowledge,” and seeks to advance hybrid materials and process technologies that transform manufacturing. It studies production processes, from the bonding of atoms and molecules to multi-material integration, making full use of theory, experiments, and simulation.
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MembersFaculty
- ProfessorMasahito Mochizuki
- LecturerKiyokazu Yasuda
- Assistant ProfessorWataru Takahara
VoicesStudent voices
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Report an errorAbout the images
The top and research theme images are illustrative and were not taken at the lab. They are cropped from Wikimedia Commons images. Cropped CC BY-SA images are provided under the same CC BY-SA license as the original (version shown on each line).
- Top image: “ChipScaleClock2 HR” NIST / Public domain (cropped)
- Bio-inspired materials and production processes: “Electronics factory in Shenzhen” Steve Jurvetson from Menlo Park, USA / CC BY 2.0 (cropped)
- Related lab (Joining Interface Control Lab): “Welding Aluminium Picture Frame” Art Graphics / CC BY-SA 4.0 (cropped)
- Related lab (Microjoining Engineering Lab [Joining and Welding Research Institute]): “Soldering a 0805” Aisart / CC BY-SA 3.0 (cropped)
- Related lab (Materials Thermodynamics Lab): “Transferring molten metal from the furnace to the ladle” Goodwin Steel Casting / CC BY-SA 2.0 (cropped)
- Related lab (Materials Design and Process Engineering Lab): “FZU 3Dprinting 4” René Volfík / CC BY-SA 4.0 (cropped)
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