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Microjoining Engineering Lab [Joining and Welding Research Institute]
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The lab explores microjoining in electronics packaging, from materials to processes.
AboutAbout the lab
Exploring microjoining, from materials to phenomena
The lab studies microjoining, from developing new joining materials for electronics packaging to establishing advanced joining processes and clarifying their mechanisms.
The lab creates joining materials with excellent functionality and high reliability, and builds new microjoining processes that use various energy sources.
It also investigates phenomena that occur at interfaces at the nano- and microscale, and works to improve the reliability of microjoints by controlling interface structure and function.
While building the fundamental science, the lab also develops applied technologies for practical use.
In the Graduate School of Engineering's lab directory, the lab is introduced under the name Microjoining Engineering Lab.
Key terms
- Electronics packaging
- Attaching electronic components to boards and the like, and assembling them into a form that works as an electronic device
- Interface
- The boundary region where two materials are in contact
- Nano- and microscale
- The world at the scale of nanometers (one billionth of a meter) and micrometers (one millionth of a meter)
ResearchResearch themes
The lab studies everything from developing new joining materials for electronics packaging to establishing advanced joining processes and clarifying their mechanisms. Alongside building the fundamental science, it develops applied technologies for practical use.
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MembersFaculty
- ProfessorHiroshi Nishikawa
- Associate ProfessorHiroaki Tatsumi
- Assistant ProfessorRyo Iioka
VoicesStudent voices
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Report an errorAbout the images
The top and research theme images are illustrative and were not taken at the lab. They are cropped from Wikimedia Commons images. Cropped CC BY-SA images are provided under the same CC BY-SA license as the original (version shown on each line).
- Top image: “Soldering a 0805” Aisart / CC BY-SA 3.0 (cropped)
- Materials and processes for microjoining: “Soe self-solder sleeve 5” Lead holder / CC BY-SA 4.0 (cropped)
- Related lab (Energy Conversion Mechanisms Lab [Joining and Welding Research Institute]): “Plasma spraying process” Student-julia-pwr / CC BY-SA 4.0 (cropped)
- Related lab (Composite Mechanisms Lab [Joining and Welding Research Institute]): “Material properties of metal powders for use in additive manufacturing ( )” National Institute of Standards and Technology / Public domain (cropped)
- Related lab (Process Metallurgy Lab): “US Army soldier welding two metal pieces, Fort Gregg-Adams, Virginia, March 2025” Juan F. Jimenez, Army / Public domain (cropped)
- Related lab (Joining Interface Control Lab): “Welding Aluminium Picture Frame” Art Graphics / CC BY-SA 4.0 (cropped)
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