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Process Integration Lab
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The lab explores the phenomena and technologies of tiny joints in electronic devices.
AboutAbout the lab
Understanding phenomena at tiny joints to optimize joining processes
The Process Integration Lab studies fine joining (micro- and nano-joining) technologies, which are indispensable in electronics packaging and elsewhere.
Electronic devices are multi-material structures in which metals, semiconductors, and organic compounds are packed tightly together. At tiny joints, the effects of phenomena that are not a problem in large joints, such as the amount of dissolution and surface tension (size effects), cannot be ignored.
The lab aims to understand phenomena specific to tiny joints and to optimize joining processes and materials, achieving highly reliable and highly functional joints.
On the lab's website, it is introduced under the name "Fukumoto Lab."
Key terms
- Fine joining
- Technology for bonding materials together in extremely small regions on the order of micrometers (μm) or nanometers (nm)
- Multi-material structure
- A structure made by combining different types of materials, such as metals, semiconductors, and organic compounds
- Size effect
- The influence of phenomena that appears as a joint becomes smaller, but is not a problem in large joints
NewsLab news
A lab introduction leaflet and tour information for incoming fourth-year students have been posted
A student received the Osaka University Engineering Alumni Association Award
A paper on the temperature dependence of the strength of Al/CFRTP joints was accepted by Composites Part B
A paper on strengthening silver-sintered joints through graded structuring was accepted by Materials & Design
A paper on friction stir spot joining of aluminum alloy and CFRTP was accepted by the Quarterly Journal of the Japan Welding Society
ResearchResearch themes
The lab works on fine joining technologies in the micrometer and nanometer range, which support the miniaturization and higher performance of electronic devices. Its research covers development of new materials for electronics, development of new joining technologies for semiconductor devices, intelligent robotic production systems, emergence of functions through hierarchical and graded structuring, and development of multiscale evaluation technologies.
View More ↗MembersFaculty
The Process Integration Lab consists of faculty members and master's and undergraduate students.As of 2026
- ProfessorShinji Fukumoto
- Associate ProfessorTomoki Matsuda
- Assistant ProfessorMichiya Matsushima
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Report an errorAbout the images
The top and research theme images are illustrative and were not taken at the lab. They are cropped from Wikimedia Commons images. Cropped CC BY-SA images are provided under the same CC BY-SA license as the original (version shown on each line).
- Top image: “SEG DVD 430 - Printed circuit board-4276” Raimond Spekking / CC BY-SA 4.0 (cropped)
- Related lab (Process Mechanics Lab): “Ultrasonic Welding” NearEMPTiness / CC BY-SA 3.0 (cropped)
- Related lab (Microjoining Engineering Lab [Joining and Welding Research Institute]): “Soldering a 0805” Aisart / CC BY-SA 3.0 (cropped)
- Related lab (Composite Mechanisms Lab [Joining and Welding Research Institute]): “Material properties of metal powders for use in additive manufacturing ( )” National Institute of Standards and Technology / Public domain (cropped)
- Related lab (Plasma Properties and Engineering Lab): “LPP - Laboratoire de Physique des Plasmas - UMR 764822” Ecole polytechnique / Paris / France / CC BY-SA 2.0 (cropped)
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