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Functional Integrated Systems Lab
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The lab improves the performance of semiconductor devices with new materials and structures.
AboutAbout the lab
Higher-performance semiconductors through new materials and new structures.
The Functional Integrated Systems Lab aims to improve the performance of semiconductor integrated circuits by introducing new structures and new materials.
The lab conducts interdisciplinary research that draws on knowledge from a wide range of fields, not only electronic engineering but also mechanical engineering, chemistry, materials engineering, and electrochemistry.
The lab's work covers everything from verification by simulation to demonstration through fabrication of actual devices.
On the lab's website, it is introduced under the name "Kino Lab."
Key terms
- Negative thermal expansion
- The property of contracting in volume when heated. Materials with this property are used to introduce strain into transistors
- Tunnel FET
- An FET (a type of transistor) with a structure that uses the tunneling effect. This lab applies it to memory and biosensors
- Three-dimensional integration
- A technology that raises integration density by stacking integrated circuits vertically
- FET biosensor
- A sensor that uses a transistor structure to extract the amount of adsorbed molecules as an electrical signal
NewsLab news
Associate Professor Kino co-authored a chapter in "Latest Development Trends, Control Technologies, and Applications of Negative Thermal Expansion Materials"
Associate Professor Kino co-authored a chapter in "Lowering the CTE of Semiconductor Packages and Countermeasures for Warpage"
Associate Professor Kino co-authored a chapter in "3D Semiconductor Packaging Technology"
Associate Professor Kino co-authored a chapter in "Development Trends in Materials for Next-Generation High-Speed, High-Frequency Transmission"
ResearchResearch themes
Aiming to further improve the performance of semiconductor devices and expand their fields of application, the lab combines knowledge from electronic engineering with mechanical engineering, chemistry, materials engineering, electrochemistry, and more. The lab works on improving performance with new materials and structures, three-dimensional integration, and higher sensitivity of FET biosensors, covering everything from verification by simulation to demonstration through device fabrication.
*Illustrative imageHigher-Performance Semiconductors with New Materials
The lab proposes a new technique that uses negative thermal expansion materials, which contract in volume when heated, to introduce strain into transistors. Introducing strain can increase the drive current of a transistor.
*Illustrative imageDevelopment and Applications of New-Structure Memory
The lab studies a new memory device that applies a tunnel FET as the drive element of flash memory. It aims to lower the drive voltage and to extend the device to new applications such as neuromorphic devices.
*Illustrative imageThree-Dimensional Integration: Stacking Integrated Circuits
As device miniaturization becomes more difficult, the lab is focusing on three-dimensional integration, which raises integration density by stacking integrated circuits vertically. While studying the underlying technologies, the lab demonstrates improved integrated circuit performance.
*Illustrative imageHigher Sensitivity for FET Biosensors
An FET biosensor obtains the amount of target molecules adsorbed on a molecular recognition element as an electrical signal. The lab aims to make it highly sensitive by using a tunnel FET structure instead of a conventional MOSFET.
MembersFaculty
The members of the Functional Integrated Systems Lab consist of faculty, master's and undergraduate students, and research students.As of 2026
- Associate ProfessorHisashi Kino
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Report an errorAbout the images
The top and research theme images are illustrative and were not taken at the lab. They are cropped from Wikimedia Commons images. Cropped CC BY-SA images are provided under the same CC BY-SA license as the original (version shown on each line).
- Top image: “SJ3159 die” Mister rf / CC BY-SA 4.0 (cropped)
- Higher-Performance Semiconductors with New Materials: “National Semiconductor 2N2222A” Mister rf / CC BY-SA 4.0 (cropped)
- Development and Applications of New-Structure Memory: “One Intel 7110A bubble memory chip and support components ( )” _brouhaha_ / CC BY-SA 2.0 (cropped)
- Three-Dimensional Integration: Stacking Integrated Circuits: “Silicon chip from a computer laser mouse under a microscope 50х” Original: Alexander Klepnev Derivative work: IamMM / CC BY-SA 4.0 (cropped)
- Higher Sensitivity for FET Biosensors: “PIR sensor for arduino” Nowforever / CC BY-SA 4.0 (cropped)
- Related lab (構成エレクトロニクス研究室): “SIP integrated circuits package” Mister rf / CC BY-SA 4.0 (cropped)
- Related lab (無機材料×深紫外レーザープロセス研究室): “Metal Oxide TFT Cross Section” NoAppliedVoltage / CC BY-SA 4.0 (cropped)
- Related lab (高性能計算研究室): “IBM Blue Gene P supercomputer” Argonne National Laboratory's Flickr page / CC BY-SA 2.0 (cropped)
- Related lab (プラズマ工学研究室): “Plasma globe 60th” Colin / CC BY-SA 3.0 (cropped)
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