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材料情報学領域
Showing the original Japanese · View translation
材料の弾性や相転移を力学と計算で探る研究室。
AboutAbout the lab
材料の弾性を、力学と計算で読み解く。
材料情報学領域
材料を
計測や
配属学生には、
Key terms
- 弾性率
- 材料に
力を 加えた ときの、 変形しにくさを 表す値 - 相転移
- 温度や
組成などの 条件で、 物質の 結晶 構造などの 状態が 別の ものに 変わる こと - マイクロメカニックス
- 材料の
微視的な 構造から、 全体の 弾性的な 性質を 理論で 調べる 考え方。 微視的弾性論とも いう
NewsLab news
修士課程の
学生が、 日本Additive Manufacturing学会 第2回講演大会で 優秀ポスター賞を 受賞 学生が、
工学賞を 受賞 生体用Ti合金の
新しい 低ヤング率化メカニズムを 解明した 論文が、 Acta Materialia誌に 掲載
ResearchResearch themes
材料を
生体用チタン合金の低弾性率化
実験科学、
チタン合金の相転移と力学特性
凍結された
*Illustrative image新しい弾性評価法と3Dプリント材料
重回帰分析を
*Illustrative image微視的弾性理論による弾性特性の解明
Eshelbyの
MembersFaculty
材料情報学領域の
- Professor多根 正和
- Associate Professor舘林 潤
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微細接合工学講座 The information on this page is compiled by the LabLog team from the lab's public information and interviews. For corrections or removal requests, please contact LabLog, not the lab.
Report an errorAbout the images
The top and research theme images are illustrative and were not taken at the lab. They are cropped from Wikimedia Commons images. Cropped CC BY-SA images are provided under the same CC BY-SA license as the original (version shown on each line).
- Top image: “Microstructure-for-the-annealed-Ti-15-3-3-3-sample” K. V. Sudhakar, Ethan Wood / CC BY 4.0 (cropped)
- 新しい
弾性評価法と 3Dプリント材料: “Iss071e ) --- A metal specimen 3D printed on the ground for ESA’s Metal 3D Printer investigation” NASA Johnson Space Center / Public domain (cropped) - 微視的弾性理論に
よる 弾性特性の 解明: “Microstructure of an Artificial Polymer–Salt Composite” Aiym Maksatkyzy / CC BY-SA 4.0 (cropped) - Related lab (溶接・接合機能設計講座
[接合科学研究所] ): “Shielded Metal Arc Welding” Weldscientist / CC BY-SA 4.0 (cropped) - Related lab (接合組織
デザイン講座 [接合科学研究所] ): “Stainless pipe weld joints” Flattrackers and Caferacers Parts and bikebuilds / CC BY-SA 2.0 (cropped) - Related lab (ナノ構造・機能評価研究分野
[産業科学研究所] ): “Transmission Electron Microscope (NIH BioArt 514)” Courtesy of NIAID Ryan Kissinger / Public domain (cropped) - Related lab (微細接合工学講座
[接合科学研究所] ): “Soldering a 0805” Aisart / CC BY-SA 3.0 (cropped)
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