A page on LabLog, a review site (not the lab's official page)
プロセスインテグレーション領域
Showing the original Japanese · View translation
電子デバイスの微小な接合部の現象と技術を探る研究室。

AboutAbout the lab
微小な接合部の現象を理解し、接合プロセスを最適化する。
プロセスインテグレーション領域は、
電子デバイスは
この
研究室の
Key terms
- 微細接合
- μm
(マイクロメートル) や nm (ナノメートル) ほどの 極めて 小さな 領域で、 材料どうしを つなぐ 技術 - マルチマテリアル構造体
- 金属、
半導体、 有機化合物など、 種類の 異なる 材料を 組み合わせて できた 構造体 - 寸法効果
- 接合部が
小さくなると 現れる、 大きな 接合では 問題に ならない 現象の 影響
NewsLab news
新4年生向けに、
研究室紹介リーフレットと 見学の 案内を 掲載 学生が、
大阪大学工業会賞を 受賞 Al/CFRTP接合継手の
強度の 温度依存性に 関する 論文が、 Composites Part B に 採択 銀焼結接合部の
傾斜構造化に よる 高強度化の 論文が、 Materials & Design に 採択 アルミ合金と
CFRTPの 摩擦撹拌点接合の 論文が、 溶接学会論文集に 採択
ResearchResearch themes
電子機器の
MembersFaculty
プロセスインテグレーション領域の
- Professor福本 信次
- Associate Professor松田 朋己
- Assistant Professor松嶋 道也
VoicesStudent voices
Ratings and reviews reflect the experiences of individual current or former students, not the lab's official views. Whether a lab has reviews, or how many, says nothing about the lab itself.
Students who take part in an interview may receive a thank-you gift worth ¥1,000, regardless of what they say.
Student ratings (0 students)
--
--
--
--
--
--
Student voices answer questions like these
- What's great about this lab?
- What did you learn after joining?
- What's the vibe, and what is the professor like?
- Who is this lab for?
- Where do graduates go?
Your experience can help younger students choose their lab. Your name won't be shown.
Write a lab reviewAnonymous · Your draft is saved if you stopRelatedLabs similar to プロセスインテグレーション領域
プロセスメカニックス領域工学部 応用理工学科もの
微細接合工学講座
複合化機構学分野
プラズマ物性工学領域工学部 応用理工学科多種The information on this page is compiled by the LabLog team from the lab's public information and interviews. For corrections or removal requests, please contact LabLog, not the lab.
Report an errorAbout the images
The top and research theme images are illustrative and were not taken at the lab. They are cropped from Wikimedia Commons images. Cropped CC BY-SA images are provided under the same CC BY-SA license as the original (version shown on each line).
- Top image: “SEG DVD 430 - Printed circuit board-4276” Raimond Spekking / CC BY-SA 4.0 (cropped)
- Related lab (プロセスメカニックス領域): “Ultrasonic Welding” NearEMPTiness / CC BY-SA 3.0 (cropped)
- Related lab (微細接合工学講座
[接合科学研究所] ): “Soldering a 0805” Aisart / CC BY-SA 3.0 (cropped) - Related lab (複合化機構学分野
[接合科学研究所] ): “Material properties of metal powders for use in additive manufacturing ( )” National Institute of Standards and Technology / Public domain (cropped) - Related lab (プラズマ物性工学領域): “LPP - Laboratoire de Physique des Plasmas - UMR 764822” Ecole polytechnique / Paris / France / CC BY-SA 2.0 (cropped)
About LabLog
LabLog is a lab review app for students only. Student members at each university interview students in labs and publish what they say. Student voices can only be read by students who sign up with a university email address. Operated by bestiee Inc.
Learn more about LabLog ↗Search engines and AI may reference the basic lab info and rating summaries on this page and the description of LabLog. Student voices are for student members only. Automated collection by programs (scraping, or input to or training of AI) is prohibited under Article 8 of the Terms of Service. If you need data for research or analysis, please contact us.