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Energy Conversion Mechanisms Lab [Joining and Welding Research Institute]
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A lab that uses plasmas and particle beams to give material surfaces high-performance functions.
AboutAbout the lab
Controlling material surfaces and interfaces with plasmas and particle beams.
The Energy Conversion Mechanisms Lab (Setsuhara Lab) studies the interaction between materials and the energy sources used for processing, such as plasmas and particle beams.
The lab pursues the fundamental science needed to enhance and precisely control the functions of material surfaces and interfaces, conducting research that leads to advances in joining science.
Using its own plasma generation and control technologies, the lab advances research and development toward low-temperature, low-damage, high-quality materials processes.
The lab also works on developing dissimilar material joining technology, which bonds different types of materials such as organic materials and metals, using atmospheric-pressure nonequilibrium plasma.
Key terms
- Plasma
- A state in which gas molecules separate into electrons and ions, with electrically charged particles flying about. Used for processing materials
- Particle beam
- A stream of particles such as electrons or ions aligned to travel in one direction. Directed at materials and used for processing
- Dissimilar material joining
- Technology for joining different types of materials to each other, such as metal and resin
ResearchResearch themes
The lab investigates how the plasmas and particle beams used in materials processing transfer energy to materials, and pursues the fundamental science needed to enhance and precisely control the functions of material surfaces and interfaces. It also creates new processing energy sources and process control methods, carrying out basic research and developing applied technologies that contribute to advances in joining science.
*Illustrative imageUnderstanding plasma–material interactions
The lab investigates the mechanisms of interaction when energy is converted and delivered to materials from processing energy sources such as plasmas and particle beams. It also studies advanced processes for controlling surfaces and interfaces.
*Illustrative imageDeveloping new plasma and particle beam sources
The lab develops new plasma sources and particle beam sources, and also researches advanced process technologies such as CVD and PVD. It works on developing and applying new processing energy sources that are effective for advanced process control.
*Illustrative imageLarge-area, low-damage plasma sources
Based on its own plasma generation and control technologies, the lab aims for low-temperature, low-damage, high-quality materials processes, with applications in large-area processes such as next-generation flat-panel displays and solar cells in mind. It is also developing meter-scale, ultra-large-area plasma sources.
*Illustrative imageLow-temperature formation of oxide semiconductor thin films
This research forms oxide semiconductor thin films at low temperature by plasma-assisted reactive sputtering, a film deposition method. Besides work on controlling deposition by changing the waveform of the voltage applied to the target, the lab has also worked on forming gallium oxide thin-film transistors.
MembersFaculty
Members of the Energy Conversion Mechanisms Lab (Setsuhara Lab) consist of faculty, visiting professors, and master's students.As of 2026
- ProfessorYuichi Setsuhara
- Associate ProfessorKosuke Takenaka
- Assistant ProfessorSusumu Toko
VoicesStudent voices
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Report an errorAbout the images
The top and research theme images are illustrative and were not taken at the lab. They are cropped from Wikimedia Commons images. Cropped CC BY-SA images are provided under the same CC BY-SA license as the original (version shown on each line).
- Top image: “Plasma spraying process” Student-julia-pwr / CC BY-SA 4.0 (cropped)
- Understanding plasma–material interactions: “Gravure plasma - chambre” Rhadamante / CC BY-SA 3.0 (cropped)
- Developing new plasma and particle beam sources: “Plasma source” Driveraorona / CC BY-SA 4.0 (cropped)
- Large-area, low-damage plasma sources: “Low pressure plasma reactor” Lucasbortoletto1337 / CC0 (cropped)
- Low-temperature formation of oxide semiconductor thin films: “Metal Oxide TFT Cross Section” NoAppliedVoltage / CC BY-SA 4.0 (cropped)
- Related lab (Microjoining Engineering Lab [Joining and Welding Research Institute]): “Soldering a 0805” Aisart / CC BY-SA 3.0 (cropped)
- Related lab (Plasma Engineering Lab [Joining and Welding Research Institute]): “US Air Force (USAF) Technical Sergeant (TSGT) Jeffrey Wright, Aircraft Metal Technician, 52nd Equipment Maintenance Squadron (EMS), uses plasma arc cutting torch to destroy a 30mm g - DPLA - 08156ad581284cc3e5ed4337a5cb0c55” Department of Defense. American Forces Information Service. Defense Visual Information Center. 1994 / Public domain (cropped)
- Related lab (Composite Mechanisms Lab [Joining and Welding Research Institute]): “Material properties of metal powders for use in additive manufacturing ( )” National Institute of Standards and Technology / Public domain (cropped)
- Related lab (Laser Processing Lab [Joining and Welding Research Institute]): “CNC Laser Cutting Machine” S zillayali / CC BY 3.0 (cropped)
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