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Laser Processing Lab [Joining and Welding Research Institute]
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The lab studies laser-based processing methods such as joining, cutting, and surface modification, starting from the fundamentals.
AboutAbout the lab
Integrating laser science and manufacturing technology
The Laser Processing Lab aims for a high-level integration of laser science and manufacturing technology, and studies laser-based material processing methods such as joining, cutting, surface modification, and separation and removal, starting from the fundamentals.
The lab clarifies what happens during processes such as welding and cutting, and aims to build systems for controlling and optimizing processing based on these results.
The lab is developing new welding and joining processes for welding and joining materials with new functions and for joining dissimilar materials.
In surface modification, which adds functions to material surfaces, the lab works on controlling how lasers and particle beams are used for thick-film processes such as overlay welding and aerosol deposition.
Key terms
- Femtosecond laser
- A laser with a pulse width on the order of femtoseconds. One femtosecond is one quadrillionth of a second
- Laser cladding
- A technology that uses a laser to form a coating on the surface of a material
- Ultrafine particle beam
- A method that accelerates ultrafine particles with a carrier gas and makes them collide with a substrate at high speed to form a film at room temperature
NewsLab news
A master's student received the Poster Award FIRST PLACE at ICALEO 2024
A master's student received the Outstanding Poster Paper Award (second place) at SLPC 2024
An undergraduate student received the Excellent Poster Award at the 100th Commemorative Meeting of the Japan Laser Processing Society
A master's student received the Best Student Award at Photonics West 2024
A master's student received the Excellent Poster Presentation Award at the Japan Welding Society meeting
ResearchResearch themes
The lab aims for a high-level integration of laser science and manufacturing technology, and carries out fundamental research on laser-based material processing methods such as joining, cutting, surface modification, and separation and removal. It develops processes using various beams, including diode lasers, femtosecond lasers, nanosecond lasers, and ultrafine particle beams.
*Illustrative imageLaser Additive Manufacturing
The lab develops laser-based metal additive manufacturing technologies, such as producing high-quality coatings by laser cladding and 3D printing of copper using blue diode lasers. By increasing the power of blue diode lasers and developing beam superposition technology, the lab has achieved processing of copper.
*Illustrative imageFemtosecond Laser Processing
The lab mainly uses lasers with a pulse width of 150 femtoseconds, which enables a wide variety of processing. One femtosecond is one quadrillionth of a second. The lab presents an example in which a periodic structure was formed in the laser-irradiated area of a titanium substrate.
*Illustrative imageRoom-Temperature Film Deposition with Ultrafine Particle Beams
Accelerating ultrafine particles with a carrier gas and making them collide with a substrate at high speed has made film deposition at room temperature possible. The lab forms films of lead zirconate titanate (PZT), used in piezoelectric elements, bioactive hydroxyapatite, and titanium oxide, used as a photocatalyst.
*Illustrative imageDiode Laser Processing
Diode lasers (semiconductor lasers) have higher oscillation efficiency than YAG lasers and CO2 lasers. Appropriate control of heat input conditions has made precise processing possible. The lab has carried out welding of materials thinner than a human hair, bending of 5 mm thick plates, and welding of aluminum alloys.
MembersFaculty
The members of the Laser Processing Lab consist of faculty, project researchers, technical assistants, secretaries, master's and undergraduate students, and working-professional doctoral students.As of 2025
- ProfessorMasahiro Tsukamoto
- Associate ProfessorYuji Sato
- Assistant ProfessorKeisuke Takenaka
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Report an errorAbout the images
The top and research theme images are illustrative and were not taken at the lab. They are cropped from Wikimedia Commons images. Cropped CC BY-SA images are provided under the same CC BY-SA license as the original (version shown on each line).
- Top image: “CNC Laser Cutting Machine” S zillayali / CC BY 3.0 (cropped)
- Laser Additive Manufacturing: “Detail of laser cladding” Lucie Prokešová / CC BY-SA 4.0 (cropped)
- Femtosecond Laser Processing: “Femtosecond laser spark” Smirnov Semen / CC BY 4.0 (cropped)
- Room-Temperature Film Deposition with Ultrafine Particle Beams: “Multicrystalline silicon wafer with thin film iridescence” Radiotrefoil / CC BY-SA 4.0 (cropped)
- Diode Laser Processing: “Diode laser” 作者不詳 / Public domain (cropped)
- Related lab (Process Mechanics Lab): “Ultrasonic Welding” NearEMPTiness / CC BY-SA 3.0 (cropped)
- Related lab (Energy Conversion Mechanisms Lab [Joining and Welding Research Institute]): “Plasma spraying process” Student-julia-pwr / CC BY-SA 4.0 (cropped)
- Related lab (Processing Physics Lab): “Cnc plasma cutting” Devaes at English Wikipedia / (Original text: Devaes (talk)) / CC BY-SA 3.0 (cropped)
- Related lab (Plasma Engineering Lab [Joining and Welding Research Institute]): “US Air Force (USAF) Technical Sergeant (TSGT) Jeffrey Wright, Aircraft Metal Technician, 52nd Equipment Maintenance Squadron (EMS), uses plasma arc cutting torch to destroy a 30mm g - DPLA - 08156ad581284cc3e5ed4337a5cb0c55” Department of Defense. American Forces Information Service. Defense Visual Information Center. 1994 / Public domain (cropped)
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