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Shimogaki Lab
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The lab designs processes that form thin films on complex three-dimensional structures.

AboutAbout the lab
Thin-film processes open the way to the next generation.
The Shimogaki Lab studies thin-film deposition processes, which form thin films on the surfaces of objects.
Materials research is not only about creating new substances; it is also deeply tied to how they are made, that is, the process.
The lab analyzes the mechanisms by which films form to bring out the full potential of the process, and adds new mechanisms to make the process itself more advanced.
The lab works on semiconductor interconnects, next-generation aerospace materials, and coatings for cutting tools.
Key terms
- Thin film
- An extremely thin film formed on the surface of an object. It is used for electronic component interconnects, tool surfaces, and more.
- Chemical vapor deposition (CVD)
- A method in which source materials are delivered as a gas and a film is formed by chemical reactions on the surface of an object.
- Ultra-large-scale integrated circuit (ULSI)
- An electronic circuit that packs a large number of very small transistors and interconnects onto a single chip.
NewsLab news
Paper published on atomic layer deposition (ALD) of cobalt
Paper published on PVD-Co(W) barrier films for interconnects
Paper published on atomic layer etching (ALE) of cobalt
Paper published on a theoretical study of gas-phase reactions in CVD
ResearchResearch themes
The lab studies processes for filling complex three-dimensional structures with functional materials and coating them with thin films. Through process design, which analyzes the mechanisms by which films form, and process enhancement, which adds new mechanisms, the lab aims to functionalize materials and improve device performance.
*Illustrative imageThin films that protect interconnects in integrated circuits
Copper interconnects in ultra-large-scale integrated circuits (ULSI) require an extremely thin film to prevent copper from diffusing out. The lab develops films made of a cobalt-tungsten alloy and investigates their properties.
*Illustrative imageSiC composite materials for aerospace
The lab fabricates composite materials in which silicon carbide (SiC) fibers are bound together with SiC. Through both computation and experiments, it studies a method in which gaseous source materials are delivered into the gaps between the fibers and react on the fiber surfaces.
*Illustrative imageHard coatings for cutting tools
Coating the edges of metal-cutting tools with hard ceramics makes them last longer and cut faster. This research elucidates the mechanisms by which films form in CVD and controls the fine structure of the films to improve performance.
MembersFaculty
The Shimogaki Lab consists of faculty members, project researchers, academic specialists, technical assistants, master's and undergraduate students, secretaries, and technical staff.As of 2026
- ProfessorYukihiro ShimogakiPublications ↗
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Report an errorAbout the images
The top and research theme images are illustrative and were not taken at the lab. They are cropped from Wikimedia Commons images. Cropped CC BY-SA images are provided under the same CC BY-SA license as the original (version shown on each line).
- Top image: “Multicrystalline silicon wafer with thin film iridescence” Radiotrefoil / CC BY-SA 4.0 (cropped)
- Thin films that protect interconnects in integrated circuits: “EPROM Microchip SuperMacro” Zephyris / CC BY-SA 3.0 (cropped)
- SiC composite materials for aerospace: “255-GRC-2002-C-01633 SiC-SiC Silicon carbide fiber reinforced silicon carbide” Photographer: TOM JARES / Public domain (cropped)
- Hard coatings for cutting tools: “Tungsten carbide inserts” Mauro Cateb / CC BY-SA 4.0 (cropped)
- Related lab (Kita Lab): “SiC wafers 6inch” FDominec / CC BY-SA 4.0 (cropped)
- Related lab (Nagashio Lab): “Graphen” AlexanderAlUS / CC BY-SA 3.0 (cropped)
- Related lab (Uchida-Toyoshima Lab): “Silicon wafer close view” Le hollandais volant / CC BY 4.0 (cropped)
- Related lab (Kondo Lab): “Perovskite solar cell” Dennis Schroeder / National Renewable Energy Laboratory / Public domain (cropped)
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