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Microdevice Lab
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The lab researches integration and packaging that join different materials at room temperature.
AboutAbout the lab
Joining different materials at room temperature.
The Microdevice Lab researches heterogeneous integration and packaging, which combine different materials, as well as room-temperature bonding technology.
It also lists photonics-electronics convergence, hybrid bonding, and chiplets as research themes.
The lab also works on electro-optic devices such as thin-film LNOI, and on optical and high-frequency technologies.
Key terms
- Heterogeneous integration
- Combining different types of materials or devices and building them into a single unit
- Room-temperature bonding
- A bonding method that attaches materials such as wafers to each other under room-temperature conditions
- LNOI
- A structure in which a thin film of lithium niobate is placed on top of an insulator (lithium niobate on insulator)
ResearchResearch themes
The Microdevice Lab has heterogeneous integration and packaging and room-temperature bonding technology as its research themes. It also works on photonics-electronics convergence and on optical and high-frequency technologies.
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MembersFaculty
- ProfessorRyo Takigawa
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Report an errorAbout the images
The top and research theme images are illustrative and were not taken at the lab. They are cropped from Wikimedia Commons images. Cropped CC BY-SA images are provided under the same CC BY-SA license as the original (version shown on each line).
- Top image: “3x3 Quilt Packaging Chip Array” Jacksontlu / CC BY-SA 4.0 (cropped)
- Integrating Dissimilar Materials by Room-Temperature Bonding: “B-e-wafercomposition” Fraunhofer ENAS, D. Neumann / CC BY-SA 3.0 de (cropped)
- Related lab (Functionality Emergence Integrated Systems Lab): “2N1307 transistor bond wires” Mister rf / CC BY-SA 4.0 (cropped)
- Related lab (High-Frequency Integrated Circuits and Microwave Communication Devices Lab): “RFID-tag-with-energy-harvesting-module” B. Molina-Farrugia, A. Rivadeneyra, J. Fernández-Salmerón, F. Martínez-Martí, J. Banqueri, M. A. Carvajal / CC BY 4.0 (cropped)
- Related lab (Information Photonics Lab): “Photonic Spectrum prototype being tested by Autumn Siegel” Victoria Lee Croasdell / CC BY-SA 4.0 (cropped)
- Related lab (Circular Integrated Photonics Lab): “Inkjet-Nummerierwerk” Monster4711 / CC BY-SA 4.0 (cropped)
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