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Nano Intelligent Systems [Shimatsu] Lab
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A lab researching room-temperature wafer bonding technology and magnetic thin films.
AboutAbout the lab
Room-temperature bonding technology and magnetic thin films.
Shimatsu Lab researches technology for bonding wafers of semiconductors, ceramics, and other materials at room temperature, and magnetic thin films with large magnetic anisotropy.
Using ultra-high vacuum technology, the lab makes thin films in a clean environment and controls their structure, covering research from materials development to device applications.
Beyond information and communications, the lab collaborates with researchers at universities and companies in fields such as space science, precision instruments, automobiles, and medicine to create new devices and equipment.
The lab's official affiliation is the Frontier Research Institute for Interdisciplinary Sciences, but because of its experimental facilities, it mainly conducts research at the Research Institute of Electrical Communication.
Key terms
- Atomic diffusion bonding
- A method of bonding at room temperature by using the surface energy and atomic rearrangement of a thin microcrystalline metal film on the wafer surface.
- Magnetic anisotropy
- The magnetic energy that constrains the movement of spins within a magnetic material.
- Energy-assisted recording
- A method of recording information on magnetic hard disks with the assistance of thermal energy or microwaves.
NewsLab news
Professor Shimatsu received the FY2025 (Reiwa 7) Commendation for Science and Technology by the Minister of Education, Culture, Sports, Science and Technology, Prize for Science and Technology (Research Category)
A master's student received a Best Poster Presentation Award at LTB-3D 2024
ResearchResearch themes
To make high-performance electronic devices and equipment, the lab researches new room-temperature wafer bonding technology and the formation of magnetic thin films with large magnetic anisotropy. Building on thin-film formation in a clean environment using ultra-high vacuum technology, it pursues work from materials development to device applications.
*Illustrative imageAtomic diffusion bonding, a room-temperature bonding method
The lab proposes a method that bonds wafers at room temperature by using the surface energy and atomic rearrangement of a thin microcrystalline metal film on the wafer surface. It can bond regardless of material, and the lab conducts joint research with companies toward forming a variety of devices.
*Illustrative imageMagnetic thin films with large magnetic anisotropy
Toward higher density in magnetic hard disks, the lab conducts basic research with companies on L10-FePt ordered-alloy granular media for next-generation energy-assisted recording. It also studies microwave-assisted magnetization reversal.
MembersFaculty
Shimatsu Lab members consist of faculty members, researchers, master's students, undergraduate students, and secretaries.
- ProfessorTakehito Shimatsu
VoicesStudent voices
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Report an errorAbout the images
The top and research theme images are illustrative and were not taken at the lab. They are cropped from Wikimedia Commons images. Cropped CC BY-SA images are provided under the same CC BY-SA license as the original (version shown on each line).
- Top image: “Камера з надвисоким вакуумом” ValerieDesign / CC BY-SA 4.0 (cropped)
- Atomic diffusion bonding, a room-temperature bonding method: “Wafer 20110212” Sangitiana Fararano / CC BY-SA 2.0 (cropped)
- Magnetic thin films with large magnetic anisotropy: “Seagate ST33232A hard disk inner view” Eric Gaba (Sting - fr:Sting) This image was created with CombineZP by 11 ( It was created out of 11 single images.). / CC BY-SA 3.0 (cropped)
- Related lab (Dielectric Nanodevices Lab): “Ferroelectric-wiki-w3” Chem538w10grp5 / Public domain (cropped)
- Related lab (Electronic Equipment Engineering Lab): “A semiconductor wafer on a dicing (blue) tape. Few chips (dies) from the wafer have already been picked up (removed) for further manufacturing” Khpsoi / CC BY-SA 4.0 (cropped)
- Related lab (Ubiquitous Energy Lab): “MSS1 CDSM flight model” A. Pollinger / CC BY 4.0 (cropped)
- Related lab (Innovative Spintronics Device Lab): “Unisys SCAMP die” Pauli Rautakorpi / CC BY 3.0 (cropped)
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