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電子機器工学[日暮・竹内]研究室
Showing the original Japanese · View translation
異種の材料を低温・常温でつなぐ、接合技術の研究室。
AboutAbout the lab
小型高機能な集積デバイスをめざし、異種材料を実装する。
日暮・竹内研究室は、
半導体の
小型・高性能・省エネルギー性に
将来の
Key terms
- ヘテロジニアス集積
- 異なる
材料や 機能を 持つ部品を、 一つの デバイスに まとめて 組み込む 技術 - 表面活性化接合
- 材料どうしを
常温で つなぐ、 常温接合技術の 一つ - ポリシラザン
- SiO2の
前駆体と して 知られる ポリマー材料。 車体の ガラスコーティングとしても 知られる
NewsLab news
半導体先端パッケージング・ヘテロ集積化技術の
コンソーシアム 「T-CHIPS」を 設立 日暮教授が
分担執筆した 「半導体デバイスの 接合技術・材料の 開発動向と 信頼性評価」が 出版 博士課程の
学生らの 論文が、 Ceramics International に 掲載 博士課程の
学生が、 エレクトロニクス実装学会の アカデミックプラザ賞を 受賞
ResearchResearch themes
異種の
*Illustrative image表面活性化接合によるデバイス実装
接合は
*Illustrative image粗い面を平滑にして常温接合
研磨が
*Illustrative imageポリシラザンを介した常温接合
SiO2の
*Illustrative imageAu中空バンプでの低温・低荷重接合
先端が
MembersFaculty
日暮・竹内研究室の
- Professor日暮 栄治
- Associate Professor竹内 魁
- Assistant Professor後藤 慎太郎
VoicesStudent voices
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Write a lab reviewAnonymous · Your draft is saved if you stopRelatedLabs similar to 電子機器工学[日暮・竹内]研究室
![Image of research at 次世代スピンエレクトロニクス材料工学[角田]研究室](/img/707bb1a5fedb0d45-800.webp)
![Image of research at グリーンパワーエレクトロニクス[遠藤(哲)]研究室](/img/54b2ddd9be870f64-800.webp)
The information on this page is compiled by the LabLog team from the lab's public information and interviews. For corrections or removal requests, please contact LabLog, not the lab.
Report an errorAbout the images
The top and research theme images are illustrative and were not taken at the lab. They are cropped from Wikimedia Commons images. Cropped CC BY-SA images are provided under the same CC BY-SA license as the original (version shown on each line).
- Top image: “A semiconductor wafer on a dicing (blue) tape. Few chips (dies) from the wafer have already been picked up (removed) for further manufacturing” Khpsoi / CC BY-SA 4.0 (cropped)
- 表面活性化接合に
よる デバイス実装: “3x3 Quilt Packaging Chip Array” Jacksontlu / CC BY-SA 4.0 (cropped) - 粗い面を
平滑に して 常温接合: “Multicrystalline silicon wafer with thin film iridescence” Radiotrefoil / CC BY-SA 4.0 (cropped) - ポリシラザンを
介した 常温接合: “IMaGe 31072R – Silicon Wafer 20120926” Rob Bulmahn / CC BY 2.0 (cropped) - Au中
空 バンプでの 低温・低荷重接合: “MAC01” Mister rf / CC BY-SA 4.0 (cropped) - Related lab (物理情報回路学分野
（竹内研究室） ): “Hero-64-pixel-array-superconducting-nanowire-single-photon-detector-b” NASA/JPL-Caltech; Text by Dr. Warren Holmes / Public domain (cropped) - Related lab (次世代スピンエレクトロニクス材料工学
[角田] 研究室): “Actuator arm assembly of a hard disk drive” Mk2010 / CC BY 4.0 (cropped) - Related lab (グリーンパワーエレクトロニクス
[遠藤(哲)] 研究室): “Wafer scale integrated circuit on 300 mm wafer” Wikideas1 / CC0 (cropped) - Related lab (革新的スピントロニクスデバイス研究室): “Unisys SCAMP die” Pauli Rautakorpi / CC BY 3.0 (cropped)
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