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Mita Lab
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A lab that uses semiconductor microfabrication to create devices in which electrical and mechanical functions merge.
AboutAbout the lab
Integrated microsystems inspired by the functions of nature
The Mita Lab studies advanced integrated microsystems inspired by the functions of nature.
From an electronic engineering perspective, the lab builds next-generation micro- and nano-devices that merge electrical and mechanical functions, along with systems that use them.
Making full use of the equipment in the Super Clean Room of the Takeda Sentanchi Building, the lab carries out deep microfabrication.
Its research themes include integration technology that combines MEMS and LSI on a single chip, mechanical memory, and light-receiving devices.
Key terms
- MEMS
- Technology that uses semiconductor microfabrication to build mechanical parts and electronic circuits together on a tiny chip
- Monolithic integration
- Fabricating, on a single chip, components that were previously made separately
- Photodiode
- A semiconductor device that conducts current when light strikes it. It is used to convert light into an electrical signal
NewsLab news
An undergraduate student received the Dean of the Faculty of Engineering Award (Research) and the Outstanding Graduation Thesis Award
A master's student received the Outstanding Master's Thesis Award
Won the top prize in the photo contest at the Symposium on Sensors, Micromachines and Applied Systems
A doctoral student received the Outstanding Paper Presentation Award from the Institute of Electrical Engineers of Japan
A master's student received the Dean of the Graduate School of Engineering Award and the Head of the Department of Electrical Engineering and Information Systems Award
ResearchResearch themes
The lab researches next-generation micro- and nano-devices that merge electrical and mechanical functions, and systems that use them, from an electronic engineering perspective. Making full use of the equipment in the Super Clean Room, it works on precise deep microfabrication and on manufacturing technologies for new semiconductor devices based on microfabrication.
*Illustrative imageMEMS-LSI Monolithic Integration
The lab adds MEMS post-processing to standard CMOS circuits to create CMOS islands separated by trenches. It studies methods for combining MEMS and LSI on a single chip.
*Illustrative imageMeasuring Fine Sidewalls Without Damaging Them
This is a technique for measuring the shape of the sidewalls of deep microstructures without damaging them. The lab is developing a method called Swing-Probing, which oscillates a probe to measure the shape in the vertical direction.
*Illustrative imageDeep-Trench Vertical Photodiodes
These are photodiodes with P-N junctions formed in deep submicron trenches. The goal is to detect polarized light with higher efficiency.
*Illustrative imageMicro-Latch Mechanism
The lab aims to create MEMS memory with low power consumption and a long lifetime. This research builds micro-latch structures that hold a state in the way a latch does.
MembersFaculty
Mita Lab members include faculty, staff such as project researchers, technical specialists, and academic specialists, joint researchers, and students in the doctoral, master's, and undergraduate programs.As of 2026
- ProfessorYoshio MitaPublications ↗
- Project Associate ProfessorRyosho NakanePublications ↗
- Project Associate ProfessorAkio Higo
- Assistant ProfessorShun YasunagaPublications ↗
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Report an errorAbout the images
The top and research theme images are illustrative and were not taken at the lab. They are cropped from Wikimedia Commons images. Cropped CC BY-SA images are provided under the same CC BY-SA license as the original (version shown on each line).
- Top image: “MEMS Microcantilever in Resonance” Patrick C. Fletcher (talk) 17:48, 20 May 2008 (UTC) / CC BY-SA 3.0 (cropped)
- MEMS-LSI Monolithic Integration: “Microelectromechanical system (MEMS) ( )” National Institute of Standards and Technology / Public domain (cropped)
- Measuring Fine Sidewalls Without Damaging Them: “Slantedblacksilicon” Zhida Xu, Jing Jiang, Manas Ranjan Gartia, and Gang Logan Liu / CC BY-SA 4.0 (cropped)
- Deep-Trench Vertical Photodiodes: “Photodiode array chip” Fulvio314 / CC BY-SA 3.0 (cropped)
- Micro-Latch Mechanism: “MEMS-based compliant mechanism” Agustin Herrera-May / CC BY-SA 4.0 (cropped)
- Related lab (Tabata-Matsui-Seki Lab): “Pulsed Laser Deposition in Action” Adam Andersen Læssøe / CC BY-SA 4.0 (cropped)
- Related lab (Takamiya Lab): “TI HC32 Die Shot (4x2-Input OR Gate)” Cole L / CC BY-SA 2.0 (cropped)
- Related lab (Toprasertpong Lab): “Ferroelectric domains at a PZT grain boundary ( )” Oak Ridge National Laboratory / CC BY 2.0 (cropped)
- Related lab (Takenaka Lab): “Silicon Photonics 300mm wafer” Ehsanshahoseini / CC BY-SA 4.0 (cropped)
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