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Nano-Micro Packaging Lab
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A lab that bonds dissimilar materials at room temperature to build next-generation optical and electronic devices.
AboutAbout the lab
Room-temperature bonding for next-generation devices.
The Nano-Micro Packaging Lab studies packaging of optical and electronic devices, centered on room-temperature bonding technology that joins dissimilar materials without solder or adhesive.
The lab aims to create ultra-compact, highly functional, low-power sensors, information and communication systems, and AI devices that will underpin the future of IoT and AI.
The lab is committed to active collaboration with research institutions and companies in Japan and abroad, and also collaborates in some areas with the Kanaya Lab and Kato Lab in the same division.
On the lab's website, the lab is also introduced under the name "Takigawa Lab."
Key terms
- Room-temperature bonding technology
- A technology that directly bonds dissimilar materials to each other at room temperature, without solder or adhesive.
- IoT
- Short for Internet of Things. A system in which all kinds of everyday objects are connected to the internet.
- Heterogeneous material integration
- Combining multiple materials with different properties inside a single device.
ResearchResearch themes
Centered on room-temperature bonding technology, which joins dissimilar materials without solder or adhesive, and on 3D microfabrication technology, the lab studies optical and electronic packaging technologies for next-generation devices that will underpin the future of IoT and AI. Focusing on the new functions that appear at nanoscale bonded interfaces, the lab aims to systematize bonding technology academically and to create ultra-compact, highly functional, low-power sensors, information and communication systems, and AI devices.
*Illustrative imageOptical and electronic packaging technology
The lab investigates and controls the region near the bonding interface at the atomic scale, aiming to establish room-temperature bonding of dissimilar materials. It takes on the development of foundational technologies for packaging and integrating semiconductor lasers, photodiodes, LSIs, and more.
*Illustrative imageMicro- and nano-devices with heterogeneous material integration
Using room-temperature bonding and 3D microfabrication technology, the lab builds ultra-compact, highly functional, low-power devices that integrate dissimilar materials. Examples are ultrahigh-speed LiNbO3 optical modulators, surface acoustic wave filters, and quantum sensors.
*Illustrative image3D microsystems
The lab studies technologies that stack sensors, optical circuits, electronic circuits, microfluidics, antennas, and more in three dimensions to combine different functions into one. It aims to contribute to the creation of sensor systems that can be applied to healthcare, robotics, and other fields.
MembersFaculty
The members of the Nano-Micro Packaging Lab are faculty members, technical staff, and PhD, master's, and undergraduate students.As of 2026
- ProfessorRyo Takigawa
VoicesStudent voices
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Report an errorAbout the images
The top and research theme images are illustrative and were not taken at the lab. They are cropped from Wikimedia Commons images. Cropped CC BY-SA images are provided under the same CC BY-SA license as the original (version shown on each line).
- Top image: “Micro-chips wafer (69536)” Syced / CC0 (cropped)
- Optical and electronic packaging technology: “Optoelectronics experiment” Adelphi Lab Center / CC BY 2.0 (cropped)
- Micro- and nano-devices with heterogeneous material integration: “Song Meter Micro 2 passive acoustic recording device (open)” T. R. Shankar Raman / CC BY-SA 3.0 (cropped)
- 3D microsystems: “A MicroVision MEMS mirror” S2upidOnReddit / CC BY-SA 4.0 (cropped)
- Related lab (Electronic Materials Lab): “Photonics chip 1” Tal b2 / CC BY-SA 4.0 (cropped)
- Related lab (Bio-inspired Microsystems Lab): “Colias micro-robot” Farshadarvin / CC BY-SA 4.0 (cropped)
- Related lab (Advanced Magnetic Sensing Lab): “Rozkładanie magnetometru” Glab310 / CC BY 4.0 (cropped)
- Related lab (Functional Integrated Systems Lab): “SJ3159 die” Mister rf / CC BY-SA 4.0 (cropped)
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