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Micro Thermal Engineering Lab
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The lab investigates how heat is transferred, starting from the molecular scale.
AboutAbout the lab
Solving how heat is transferred, from the molecular scale
The Micro Thermal Engineering Lab studies processes of energy utilization and heat transfer using methods such as atomic- and molecular-scale simulation.
The lab considers creating new ways of using energy and developing energy-saving technologies to be essential challenges for realizing a sustainable society.
The lab independently develops computational techniques such as numerical analysis and deep learning, and also validates simulation results experimentally.
The lab's website introduces it as a lab in the Thermal and Fluid Dynamics Group, Department of Mechanical Engineering, Graduate School of Engineering.
Key terms
- Molecular dynamics simulation
- A method that computes and tracks the motion of atoms and molecules on a computer to study how heat and matter are transported
- Interfacial thermal resistance
- A measure of how difficult it is for heat to cross the boundary between a fluid and a solid. It changes with surface modification and microstructures
- Frost formation
- The deposition of frost on a cold surface. It is known that the performance of heat exchangers operating below 0°C drops significantly because of frost formation
NewsLab news
A student received the Young Researcher Excellent Presentation Fellow Award from the Japan Society of Mechanical Engineers
The SCREEN Future Collaborative Research Institute was established
An undergraduate student received the Best Presentation Award at the Graduation Research Presentation Meeting of the Kansai Branch of the Japan Society of Mechanical Engineers
ResearchResearch themes
To develop new ways of using energy and energy-saving technologies, the lab aims to understand scientifically the processes of energy utilization and heat transfer. It independently develops techniques such as atomic- and molecular-scale simulation, numerical analysis, and deep learning, and also carries out experimental validation and technology development.
*Illustrative imageEffects of Nanostructures on Interfacial Heat Transport
Modifying a heat transfer surface at the molecular scale or adding microstructures changes the interfacial thermal resistance between a fluid and a solid. The lab investigates the effects of local regions and the effects on nucleation during phase change, using molecular dynamics simulation and experiments.
*Illustrative imageEffects of Nanostructures on Frost Formation
It is known that the performance of heat exchangers operating below 0°C drops significantly because of frost formation. The lab uses molecular dynamics simulation to investigate how the wettability and microstructures of heat transfer surfaces affect the freezing of water droplets and interfacial thermal resistance.
*Illustrative imageAnalysis of Flows with Reaction and Heat Transport
Simulating fluids with reaction and heat transport is becoming important for optimizing catalyst structures and designing nano- and microscale devices. The lab investigates industrially important microscale flows with molecular dynamics simulation to elucidate the underlying phenomena.
*Illustrative imageThermofluid Phenomena in Semiconductor Cleaning Processes
The lab studies thermofluid phenomena in cleaning processes, which are important in semiconductor device manufacturing. In particular, it aims to elucidate and control wetting and phase change phenomena that occur near nanostructures.
MembersFaculty
The members of the Micro Thermal Engineering Lab consist of faculty, administrative assistants, visiting researchers, doctoral, master's, and undergraduate students, and SEEDS program participants.As of 2026
- ProfessorMasahiko Shibahara
- Associate ProfessorKunio Fujiwara
VoicesStudent voices
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Report an errorAbout the images
The top and research theme images are illustrative and were not taken at the lab. They are cropped from Wikimedia Commons images. Cropped CC BY-SA images are provided under the same CC BY-SA license as the original (version shown on each line).
- Top image: “RAKON STP2734B LF OCXO Thermal Imaging” Mister rf / CC BY-SA 4.0 (cropped)
- Effects of Nanostructures on Interfacial Heat Transport: “Heat-transmittance-means2” Kmecfiunit, cmglee / CC BY-SA 4.0 (cropped)
- Effects of Nanostructures on Frost Formation: “Dülmen, Hausdülmen, Distel” Dietmar Rabich / CC BY-SA 4.0 (cropped)
- Analysis of Flows with Reaction and Heat Transport: “X-43A (Hyper - X) Mach 7 computational fluid dynamic (CFD)” NASA / Public domain (cropped)
- Thermofluid Phenomena in Semiconductor Cleaning Processes: “Wafer” Santi / CC BY-SA 2.0 (cropped)
- Related lab (Quantum Materials Physics Lab): “Uraninite crystal structure (Wyckoff 1963) polyhedra model crystallographic standard alignment” Ra'ike (Wikipedia) / CC0 (cropped)
- Related lab (Solid Mechanics Lab): “The brittle fracture surface of low-carbon steel” DanilovVA / CC BY-SA 4.0 (cropped)
- Related lab (Intelligent Machine Systems Lab): “PR2 robot with advanced grasping hands” Oleg Alexandrov / CC BY-SA 3.0 (cropped)
- Related lab (Materials Ultrafine Process Engineering Lab): “Transmission electron microscopy (TEM)” Database Center for Life Science (DBCLS) / CC BY 3.0 (cropped)
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