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Electronic Device Engineering Lab
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A lab that creates unprecedented electronic devices using new materials such as organic semiconductors.
AboutAbout the lab
New electronic devices from new semiconductors
The Electronic Device Engineering Lab conducts broad research on new electronics, based on semiconductor engineering and electronic properties of materials.
The lab works with new semiconductors such as organic semiconductors, organic conductors, polymer materials, and oxide semiconductors, and investigates the physical phenomena and technologies that connect to the semiconductor industry and printed electronics.
Its current focus is thin-film devices and device physics, 3D flexible devices and physical AI, and the development of measurement systems.
The lab covers a wide range of topics, from basic science to the stage just before industrial application.
Key terms
- Organic semiconductor
- A semiconductor made of carbon-containing molecules. It has properties that silicon lacks, such as being bendable and being able to be made by coating.
- Printed electronics
- A method of making circuits and devices by printing them with printing technology. It suits large areas and flexible substrates.
- Physical AI
- AI that works through objects that operate in the real world, such as robots and sensors.
NewsLab news
A paper by Professor Sakai and colleagues was published in Japanese Journal of Applied Physics
A paper by Professor Sakai and colleagues was published in Applied Sciences
ResearchResearch themes
The lab pursues research built on three pillars: thin-film devices and their device physics, 3D flexible devices and physical AI, and the development of measurement systems. It covers a wide range, from basic science to the stage just before industrial application, and opens up new research areas every year.
*Illustrative imageUltrafast observation of carrier injection
The lab observes, at ultrafast speed and across time scales from picoseconds to milliseconds, how charge enters thin-film devices. This research aims to understand the physics of devices while they are operating.
*Illustrative image3D flexible electronics
This research extends bendable electronics into three dimensions and combines them with physical AI. It explores which industries will use flexible electronics in the future.
*Illustrative imageNew printed electronics
This research develops new printed, additive, flexible electronics that use the xerography (photocopier printing) process.
*Illustrative imageSimulation of materials and devices
Using supercomputers and quantum computer simulators, the lab computationally investigates the behavior of materials and devices.
MembersFaculty
- ProfessorMasatoshi Sakai
VoicesStudent voices
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Report an errorAbout the images
The top and research theme images are illustrative and were not taken at the lab. They are cropped from Wikimedia Commons images. Cropped CC BY-SA images are provided under the same CC BY-SA license as the original (version shown on each line).
- Top image: “Marantz CD63SE - VAM1202 bottom 01” Retired electrician / CC0 (cropped)
- Ultrafast observation of carrier injection: “TCSPC schematic” Sobarwiki / Public domain (cropped)
- 3D flexible electronics: “Flexible display” U.S. Army RDECOM / CC BY 2.0 (cropped)
- New printed electronics: “Samsung laser toner cartridge side view” W.carter / CC BY-SA 4.0 (cropped)
- Simulation of materials and devices: “Quantum computer, Germany (06)” European Union / CC BY 4.0 (cropped)
- Related lab (Power Conversion Lab): “Nelson Bipole Thyristors” Wtshymanski at English Wikipedia / Public domain (cropped)
- Related lab (Ishii-Fukagawa Lab): “AMOLED display microphoto 002 front ( )” Jan Helebrant / CC BY-SA 2.0 (cropped)
- Related lab (Yoshida Lab): “SynchrotronLight” Canadian Light Source Inc. / CC BY-SA 2.0 (cropped)
- Related lab (Krüger-Iwahara Lab): “Desyxps” MichaelBueker / CC BY 3.0 (cropped)
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