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Water Cooling Technology and Thermophysical Property Measurement Lab
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A thermophysics lab that investigates how heat is transferred, using materials and droplets.
AboutAbout the lab
Investigating how heat is transferred, through materials and droplets.
The Thermophysical Engineering Lab studies the development of thermoelectric materials, the measurement of thermophysical properties, and phase-change heat transfer in microscopic droplets.
Thermoelectric materials can generate electrical energy directly from temperature differences within the material, and they are expected to be applied to waste heat recovery.
The lab aims to develop excellent thermoelectric conversion materials by applying high-pressure torsion (HPT) processing to silicon to control how heat and electrons flow.
Key terms
- Thermoelectric materials
- Materials that can generate electrical energy directly from a temperature difference within the material
- High-pressure torsion (HPT)
- A processing method, also called HPT processing, that can introduce grain refinement, interfaces, and metastable phases
- Thermal conductivity
- A property that expresses how easily heat is conducted
ResearchResearch themes
The lab develops materials that convert heat into electricity and measures thermal properties. It also studies the behavior of microscopic droplets hitting solid surfaces, and heat transfer accompanied by phase change.
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MembersFaculty
The members of the Thermophysical Engineering Lab are a professor, a secretary, technical staff, and doctoral, master's, and undergraduate students.As of 2026
- ProfessorMasamichi Kono
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Report an errorAbout the images
The top and research theme images are illustrative and were not taken at the lab. They are cropped from Wikimedia Commons images. Cropped CC BY-SA images are provided under the same CC BY-SA license as the original (version shown on each line).
- Top image: “Thermocouple Connector” Harke / Public domain (cropped)
- Silicon Thermoelectric Materials via High-Pressure Torsion: “Hochdruck-Torsion” Marina Borodachenkova, Wei Wen und António Manuel de Bastos Pereira / CC BY 3.0 (cropped)
- Related lab (Technology Commercialization and Entrepreneurship Lab): “DSCN0822 University of Strathclyde Technology and Innovation Centre” AlasdairW / CC BY-SA 3.0 (cropped)
- Related lab (Technology Commercialization and Entrepreneurship Lab): “US Patent cover (US Patent 5,860,492)” USPTO / Public domain (cropped)
- Related lab (High-Pressure Hydrogen Compatible Polymer Materials Lab): “Rubber bands” Ka23 13 / CC BY-SA 4.0 (cropped)
- Related lab (Supply Chain Decarbonization Lab): “Aerial view of Manila Port's International Container terminal” Patrick Roque / CC BY-SA 3.0 (cropped)
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