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Microsystem Packaging Lab
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The lab uses tiny sensors to monitor the condition of people, animals, and infrastructure.
AboutAbout the lab
Scattering sensors to watch over people and the environment
The Microsystem Packaging Lab studies IoT devices built with tiny sensors, along with the systems that support them.
Its targets include monitoring in which sensors are attached to people or animals for long periods to track their physical condition, as well as monitoring the condition of infrastructure and similar structures.
The work builds on packaging and integration technology that embeds tiny sensors known as MEMS into devices, fabrics, and other materials.
The lab is distinguished by its focus on creating devices that can be "embedded" in the environment and advancing its research through demonstration experiments.
Key terms
- MEMS
- Very small sensors and mechanical components made with semiconductor microfabrication technology. Short for Micro Electro Mechanical Systems.
- IoT
- A system in which everyday objects and devices are given sensors and communication functions and connected to the internet to exchange information. Short for Internet of Things.
- Electronic textile
- Fabric with wiring, sensors, and small components built into it, making it an electronic device that works just by being worn.
NewsLab news
Received the Best Student Oral Presentation Award
Assistant Professor Muramatsu received the Best Oral Presentation Award
A doctoral student received the Research Encouragement Award from the Japan Institute of Electronics Packaging
Associate Professor Yamamoto received the Best Scientist Award
A master's student received the Best Presentation Award from the Japan Society for Precision Engineering
ResearchResearch themes
Building on packaging and integration technology for microsystems, including MEMS/NEMS sensors, the lab studies IoT devices and systems that monitor the condition of people, animals, and infrastructure. To put the sensing technologies it develops to use in society, the lab also actively conducts field experiments.
*Illustrative imageSensors for Monitoring Animal Health
The lab studies wireless sensor systems that monitor the health of livestock and pets over long periods. For example, it is developing a sensor that continuously measures the condition of a cow's stomach, jointly with the Institute of Animal Health at NARO (National Agriculture and Food Research Organization) and others.
*Illustrative imageWearable Devices Made from Fabric
Using MEMS technology, the lab makes electromyography (EMG) electrodes and acceleration and pressure sensors ultra-compact, and mounts them on plastic or fabric. The goal is wearable devices that are easy to wear.
*Illustrative imageWearable Devices for VR and AR
Together with the National Institute of Advanced Industrial Science and Technology (AIST), the lab is developing electronic textile devices that measure a person's movements and convey information just by being worn. The technology prints soft wiring on fabric and mounts small sensors and vibration motors on it.
MembersFaculty
The members of the Microsystem Packaging Lab consist of faculty, technical staff, secretaries, and doctoral, master's, and undergraduate students.As of 2026
- ProfessorToshihiro ItohPublications ↗
- Program-Specific Visiting ProfessorAkitsu Shigetou
- Associate ProfessorMichitaka YamamotoPublications ↗
- Assistant ProfessorShun MuramatsuPublications ↗
- Project Assistant ProfessorJarred Fastier-WoollerPublications ↗
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Report an errorAbout the images
The top and research theme images are illustrative and were not taken at the lab. They are cropped from Wikimedia Commons images. Cropped CC BY-SA images are provided under the same CC BY-SA license as the original (version shown on each line).
- Top image: “CSIRO ScienceImage 3876 A remote sensing node part of CSIROs Fleck wireless sensor network technology” Stephan Brosnan, CSIRO / CC BY 3.0 (cropped)
- Sensors for Monitoring Animal Health: “Milchkuh auf Weide in NRW” Angela Marie / CC BY 2.0 (cropped)
- Wearable Devices Made from Fabric: “Gestickte Textile Sensorflächen” Forster Rohner AG / CC BY-SA 3.0 de (cropped)
- Wearable Devices for VR and AR: “Wireless electronic textiles” MW AHM / CC BY-SA 4.0 (cropped)
- Related lab (金秀研究室): “Lab on a Chip ( )” National Institute of Standards and Technology / Public domain (cropped)
- Related lab (金研究室): “Meso reactor detail iX-factory without Logo” IX-factory STK / CC BY-SA 3.0 (cropped)
- Related lab (梶原研究室): “Standard two plate injection molding tool” Britiju at English Wikipedia / Public domain (cropped)
- Related lab (音響創成工学研究室): “Levitación acústica” Richard Haberkern / CC BY-SA 4.0 (cropped)
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